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SU-8 2010 is a high contrast, epoxy based photoresist designed for micromachining and other microelectronic applications, where a thick, chemically and thermally stable image is desired. 

 SU-8 2010 iswhich has been widely used  by  MEMS  producers  for  many  years.

 SU-8 3000 has been formulated for improved adhesion and reduced coating stress. 

The viscosity range of SU-8 3000 allows for film thicknesses of 4 to 120 μm in a single coat. 

 SU-8 3000 has excellent imaging characteristics and is capable of producing very high, over 5:1 aspect ratio structures. 

 SU-8 3000 has very high optical transmission above 360 nm, which makes it ideally suited for imaging near vertical sidewalls in very thick films. 

 SU-8 3000 is best suited for permanent applications where it is imaged, cured and left on the device.
Processing Guidelines SU-8 3000 is most commonly exposed with conventional UV (350-400 nm) radiation, although i-line (365 nm) is recommended.  

It may also be exposed with e-beam or x-ray radiation.  Upon exposure, crosslinking proceeds in two steps (1) formation of a strong acid during the exposure step, followed by (2) acid-catalyzed, thermally driven epoxy cross-linking during the post exposure bake (PEB) step.  A normal process is:  spin coat, soft bake, expose, PEB, followed by develop.  Substrate Preparation To obtain maximum process reliability, substrates should be clean and dry prior to applying